Decker Horninger and Pierce Geary

Recent Posts

Reliable Wire Bonding Through Quality Data Collection for Industry 4.0

| Decker Horninger and Pierce Geary

Wire bonding and sintering are critical processes involved in the manufacture of a majority of electronic devices. These processes are used to connect silicon chips, integrated circuits (ICs), and...

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Adhesion Process, Electronics, Surface Preparation & Treatment

The Best Method of Controlling HMDS Use in Semiconductor Manufacturing

| Decker Horninger and Pierce Geary

Semiconductors are one of the most fascinating areas of electronics manufacturing. The ability to “grow” almost irreducibly small integrated circuit components on silicon wafers has made an...

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